Intel Lakefield CPU using 3D Foveros possibly spotted in 3DMark database TechSpot

Reputed hardware leaker APISAK discovered an interesting entry in the 3DMark database over the weekend, one that points to Intel's Lakefield processors boasting the chipmaker's 3D Foveros chip stacking technology. APISAK secured a screenshot of the entry, in addition to breaking the news via Twitter.





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